A Tk35.14 crore workforce development programme will train 3,500 graduates for the semiconductor sector as the Bangladesh Semiconductor Industry Association (BSIA) signed a contract with Skills for Industry Competitiveness and Innovation Program (SICIP).
Running from February 2026 to December 2028, the initiative aims to build industry-ready professionals through structured, specialised training, BSIA said in a press release.
The agreement was formalised at the SICIP office in Dhaka on Monday.
On behalf of their respective organisations, SICIP Executive Project Director Mohammed Walid Hossain and BSIA President M A Jabbar signed the contract.
As part of the arrangement, BSIA will train graduates from electrical and electronic engineering, electronics and communication engineering, computer science and engineering, applied physics and other relevant disciplines.
A total of 3,500 participants will undergo six specialised courses designed to meet industry demand.
Included in the curriculum are IC design and layout engineering and advanced physical design programme from register transfer level to graphic database system II.
The training also covers design for testability and verification engineering programme for application-specific integrated circuit designers and applied semiconductor systems focusing on power devices and industrial integration.
Smart systems engineering centred on embedded design and semiconductor application interfaces, along with packaging and testing, complete the course structure.
Each course will run for three months, comprising 240 hours of instruction.
Highlighting implementation standards, Walid Hossain said high-quality delivery and strong monitoring throughout the programme remain key priorities.
Achieving at least 65 per cent job placement of certified trainees is one of the core targets, he said.
Expressing confidence in the collaboration, he said the partnership with BSIA will produce competent professionals prepared for both the domestic semiconductor ecosystem and the global market.
Acknowledging the support received, Jabbar thanked SICIP and officials of both organisations for making the initiative possible.
Describing the agreement as a milestone, he said it will help create a critical mass of skilled manpower to support advanced electronics and semiconductor services.
Strengthening industry readiness and enhancing Bangladesh’s competitiveness in the global semiconductor value chain are central goals of the programme, he added.
Present at the signing ceremony were Directorate of Expenditure and Programme Department (DEPD) Additional Secretary Program Management Mahfuzul Alam Khan and Joint Secretary Program Management Manjur Alam Prodhan.
Also in attendance were Joint Secretary Program Management Amina Fahmeen, DEPD Fund Management Myenul Hasan and Deputy Secretary and focal point of SICIP for BSIA Mohammad Afzal Hossain.
Representing BSIA, Senior Vice President M E Chowdhury Shameem, Director Munir Ahmed and Secretary Hashim Ahmed attended the event.
SICIP is being implemented under the Finance Division of the Ministry of Finance with financial support from the Government of Bangladesh and the Asian Development Bank.
